ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,358, issued on Feb. 10, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Bolt for battery and battery module" was invented by Seon Gi ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,369, issued on Feb. 10, was assigned to CONTEC Co. LTD. (Daejeon, South Korea). "Marine waste disposal apparatus using satellite image" was... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,547, issued on Feb. 10, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD. (... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,233, issued on Feb. 10, was assigned to VB Spine US Opco LLC (Leesburg, Va.). "Spinal interbody implants" was invented by Sean Corcoran (As... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,130, issued on Feb. 10, was assigned to Cirrus Logic Inc. (Austin, Texas). "Online characterization of battery model parameters with augmen... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,903, issued on Feb. 10, was assigned to University of Washington (Seattle) and University of Utah Research Foundation (Salt Lake City). "Po... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,483, issued on Feb. 10, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Route advertisement method, network device, and co... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,778, issued on Feb. 10, was assigned to FUJIFILM Corp. (Tokyo). "Sample solution concentration method and sample solution examination metho... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,763, issued on Feb. 10, was assigned to LG Electronics Inc. (Seoul, South Korea). "Point cloud data transmission device, point cloud data t... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,340, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.). "Three-dimensional metal-insulator-metal capacitors" was invente... Read More